Services
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FPGA & SoC Services
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ASIC Design Services
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Module & Hybrid Design Services
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Package Miniaturization Design ServicesLarge Area Panel (LAP) - based Embedded Die technology to perform sub-system size reduction levels that cannot be achieved via standard chip-on-board technology. |
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Rugged Power Supply Design
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Synchronization ServicesSpecialized services to help with planning, deployment and maintenance of your synchronization infrastructure. |
Overview
Services
Microsemi offers a broad range of services, ranging from custom ASIC, FPGA, RF module, RF IC, Multi-chip Package to ruggedization design services. Microsemi’s services allow customers to ensure their products can survive the toughest environments and survive a wide range of security threats, consume very low power, occupy minimal foot-prints, or simply perform exactly what customers are looking for. For more information, please visit our multiple services pages.?
